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China PCB Manufacturer, PCBA PCB Assembly Manufacturer Prospects for PCB technology

The future of PCB manufacturer and PCBA PCB assembly manufacturer is inseparable from innovation, so the fourth phase of the future of PCB manufacturer and PCBA PCB assembly manufacturer is called the innovation period (ie, the later stage of PCB industrialization). To look ahead and predict the future of PCB technology, we China PCB manufacturer and PCBA PCB assembly manufacturer will first examine some of the major changes in electronics products related to the PCB manufacturer industry in recent years.


(1) SiP and SLP

In September 2014, Apple released Watch S1. PCB manufacturer in China, PCBA PCB assembly manufacturer factory. The motherboard uses SiP (unconventional Any Layer or high-order HDI PCB manufacturer in China, the corresponding rear section uses SiP package instead of the original HDI assembly, and Watch S2 and S3 also use similar SiP packages). The specific PCB design is 8 layers, the PCB thickness is 0.35mm, the full stack structure of PCB, the minimum line width/space is 0.02/0.02mm, and the minimum Pad is 0.1mm, from Printed Circuit Board PCB manufacturer in China, PCBA PCB assembly manufacturer in China

In September 2017, Apple released the iPhone 8, iPhone 8 plus and iPhone X. The main processor A11 uses TSMC's 10nm FOWLP process (see explanation below). The motherboard PCB uses SLP (class-based board, Substrate Like PCB, which is actually MSAP). Any Layer technology), the first time PCB manufacturer the line uses the MSAP process (0.025/0.025-0.03/0.03mm), from PCB manufacturer in China, PCBA manufacturer in China.

Therefore, from the PCB design of Apple S1, iPhone 8, iPhone 8 plus and iPhone X, it can be seen that high-end HDI PCB has a tendency to be plated. The use of Samsung Motor to introduce China PCB manufacturer PCBA PCB Assembly manufacturer future HDI ultra-fine line technology capabilities can also illustrate the trend of HDI carrier board

(2) FOWLP and FOPLP

In September 2016, Apple released the iPhone 7, the main processor A10 uses TSMC's 16nm FOWLP technology (fan-out wafer level package, also known as InFOWLP, Integrated Fan-outWafer Level Packaging, integrated fan-out wafer level package) Use FOWLP instead of the PoP package that was used China PCB manufacturer all the time, that is, no longer use Substrate and package in PCBA PCB assembly manufacturer factory.

FOPLP (Fan-out Panel Level Packaging), which places the chip on the Substrate PCB circuit board by PCBA SMT PCB assembly manufacturer for RDL direct packaging (RDL: Rewiring Layer, Traditionally in strips) Strip base) Substrate through Bump and chip package; generally a Panel consists of 8-10 Strips), which is actually the embedded component PCB assembly technology mentioned above, but only buried here by China PCB manufacturer. Set the active components on PCB Printed Circuit Board.

FOPLP and FOWLP are actually two different new directions for how active components are packaged (FOPLP: board-level chip package, packaged on the entire carrier board; FOWLP: wafer level package, packaged on the wafer) by China PCB assembly PCBA manufacturer, This is also a challenge to traditional PCB assembly packaging methods to China PCB manufacturer, China PCBA manufacturer PCB assembly manufacturer. A comparison of FOPLP and FOWLP is shown by China PCB assembly   PCBA manufacturer. At present, PCBA PCB assembly manufacturer companies such as Amkor, ASE, SPIL, Frauhhofer IZM, and Samsung Electric are developing FOPLP technology same as China PCBA PCB assembly manufacturer. It can be called FOPLP for the encapsulation of Substrate to PCBA PCB assembly manufacturer.

Combining (1) SiP with SLP and (2) FOWLP and FOPLP can be seen: these new requirements or technologies are challenges and opportunities for HDI PCB manufacturers in China and other countries; Substrate is more of a challenge to PCB manufacturers and PCBA PCB assembly manufacturer.


(3) Printed electronics

Printed Electronics (also translated as printed electronics) refers to electronic circuits that combine electronic components and circuits using various printing techniques by China PCB manufacturers. Because printed electronics has the advantages of low cost, flexible shape, easy production, easy integration, and environmental protection, it has been receiving much attention by China PCB manufacturers and PCBA PCB assembly manufacturers, but it is limited by technical problems and is extremely small.

The processes by PCB manufacturer and PCBA PCB assembly manufacturer for making printed electronics include: screen printing, flexographic printing, lithography, gravure printing, inkjet printing, stencil imprinting, photoimaging, laser imaging, etc.; materials are: substrate (mostly organic film), Functional materials (ie, inks, including: conductive materials (conductive inks), semiconductor materials (organic semiconductor materials or composite materials), insulating dielectric materials), PCB factory and PCBA PCB assembly manufacturer.

This process is mainly introduced by China PCB manufacturer and PCBA PCB assembly due to the development of inkjet printing processes for the production of printed electronics. Take the example of Israel's Nano Dimension Technology PCB manufacturer and PCBA PCB assembly manufacturer factory equipment factory. In 2016, the company developed a 3D inkjet deposition printing device called Dragonfly 2020 (see Figure 48), which uses conductive inks (AgCiteTM series nanoscale silver grain conductive inks, see Figure 49) and insulating media inks (one component). Insulation dielectric material for rigid and flexible boards) Printed Circuit Board PCB; it can also print Printed Circuit Board PCBs with embedded components Printed Circuit Board PCB manufacturer and PCBA PCB assembly manufacturer. Jabil is its first commercial customer (September 2017) as China Printed Circuit Board PCB manufacturer and PCBA PCB assembly in China.

Due to the advantages of printed electronics, it is inevitable that the future will become a challenge to the traditional PCB manufacturer or PCB assembly manufacturer industry with the maturity of printed electronics.


In summary, the possible technical trends for PCB manufacturer and PCBA manufacturer PCB assembly in the future are:

(1) HDI carrier (or SiP) PCB manufacturer and PCB assembly PCBA manufacturer

(2) Substrate encapsulation (or modular) PCB manufacturer and PCB assembly PCBA manufacturer

(3) Printed electronics is gradually emerging (low-end, sample, small batch) PCB manufacturer and PCBA PCB assembly manufacturer factory


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