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Aluminum Substrate PCB Structure

Circuit Layer

The circuit layer (usually using electrolytic copper foil) is etched to form a printed circuit for assembly and connection of the device. Compared to the traditional FR-4, the same thickness and the same line width allow the aluminum substrate to carry higher currents.

Insulation Layer

The insulating layer is the core technology of the aluminum substrate, and mainly functions as bonding, insulation and heat conduction. The aluminum substrate insulation layer is the largest thermal barrier in the power module structure. The better the thermal conductivity of the insulating layer, the more favorable the diffusion of heat generated during the operation of the device, the more favorable it is to reduce the operating temperature of the device, thereby improving the power load of the module, reducing the volume, extending the life, and improving the power output.

Metal(Aluminum, Copper, Steel, etc) Substrate/Base Layer

What kind of metal is used for the insulating metal substrate depends on the thermal expansion coefficient, thermal conductivity, strength, hardness, weight, surface state and cost of the metal substrate.

In general, aluminum substrates are an ideal choice considering cost and technical performance. Available in aluminum substrates are 6061, 5052, 1060 and so on. Copper, stainless steel, iron and silicon steel sheets can also be used if they have higher thermal conductivity, mechanical properties, electrical properties and other special properties.

Edited by Global Quick Turn PCB Limited. GQTPCB is a high quality quickturn metal core PCB(MCPCB), aluminum core PCB, copper core PCB, etc manufacturer in Shenzhen, China. GQTPCB produce high quality metal core pcb(MCPCB, IMS PCB) prototype, batch aluminum core PCB for customers all over the world, is a good PCB manufacturing factory supplier

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