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PCB Manufacturer in China: PCB Classification

PCB Manufacturer in China, QuickPCB shares PCB knowledges about PCB Printed Circuit Board. There are many classification methods for PCBs by PCB manufacturer factory in China. According to the number of conductive layers, bending toughness, assembly method, substrate, special function, wire forming process, presence or absence of core plates, and surface treatment, the following classifications can be made by PCB manufacturers in China.

(1) According to the number of layers of conductive layers: single side PCB, double side PCB, multi-layer Printed Circuit Board PCB. The multilayer PCB Printed Circuit Board can be classified into a general multilayer Printed Circuit Board PCB and a multi-layer Printed Circuit Board PCB according to the number of laminations (the core is the position of the holes, and the position of the holes determines the number of laminations).

In a conventional multilayer Printed Circuit Board PCB factory manufacturer, generally, 12 or more layers are referred to as a high-level Printed Circuit Board PCB, and 16 or more layers, a hole diameter of more than 0.3 mm, and a thickness-to-diameter ratio of 8 or more are referred to as a back sheet by PCB manufacturer factory in China.

Build-up multilayer PCBs, also known as build-up multilayer Printed Circuit Boards (often referred to in the industry as microvia multilayer PCB and multilayer Printed Circuit Boards) , in essence, basically the same), the typical product of laminated multilayer Printed Circuit Board PCB is HDI PCB, which is called High Density Interconnection. Generally, the minimum line width/space is 0.075/0.075mm and below, and the minimum aperture is 0.15mm and below. Conditions such as blind, buried holes, etc. are called HDI by PCB manufacturer in China.

HDI includes first-order HDI, second-order HDI, and high-order HDI (third-order and above. Currently, more applications are applied to terminal products by HDI PCB manufacturer in China, such as third-order HDI and fourth-order HDI, and fourth-order HDI and above are basically converted to Any layer HDI PCB), Any layer (any order, or arbitrary). Layers, there are also HDI PCB manufacturer factory companies called ELIC (Every Layer Interconnect) and SLP (Substrate Like PCB, class carrier board), currently used in high-end terminal products are more than 10, 12 layers of Any Layer HDI and SLP.

(2) According to the bending toughness: Rigid Printed Circuit, flexible board (FPC, fully known as Flexible Printed Circuit Board, common hard board and soft flexible board in the industry), rigid-flex board (Rigid) -Flexible Printed Circuit, or rigid-flexible integrated board, meaning to be combined, not simply put together by PCB manufacturer), as shown by PCB manufacturer in China (Note: the physical map and schematic diagram in PCB manufacturer factory do not correspond; the same below, unless otherwise specified ). At present, the relatively high-end application on the terminal products is the rigid PCB Printed Circuit Board area for HDI.

(3) According to the assembly method, it is divided into: PCB for through-hole insertion, PCB for surface mounting, and PCB for chip-level packaging. The chip for chip-scale packaging, commonly referred to as Substrate or IC Substrate (also known as IC Carrier), is translated into (chip-level) package carrier Printed Circuit Board PCB. It is not recommended to use the package substrate as a confusing and inaccurate name; The view that Substrate does not belong to the PCB is not accurate), explained PCB manufacturer in China.

Substrate generally consists of two types: FCBGA (Flip Chip Ball GridArray) and Strip Base BGA (Ball Grid Array).

The FCBGA is a single type, usually 4-16 layers (the difficulty of making is the most difficult of all PCB products). There are many types of BGAs, such as BOC (Board on Chip), PBGA (Plastic Ball Grid Array), CSP (Chip Scale Packaging), SiP (System in package), FCCSP (Flip Chip Ball Grid Array), etc. usually 1 -10 layers PCB Printed Circuit Board

(4) According to the substrate of PCB Printed Circuit Board, it is divided into: phenolic paper base PCB, epoxy glass fiber cloth PCB, PI (polyimide) PCB, BT (bismaleimide triazine resin) PCB, PTFE (polytetrafluoroethylene) PCB, ceramic base PCB, metal core/base PCB, etc.

(5) According to the special functions of PCB, it is divided into: embedded component PCB Printed Circuit Board (internal embedded passive components or special materials for surface to realize passive components, and internal embedded active components), carbon fiber substrate PCB, photoelectric PCB Printed Circuit Board, etc.

(6) According to the wire forming process by PCB manufacturer factory in China, it is divided into: Subtractive (or Tenting, subtraction method, the core is formed by thickening on conventional copper), MSAP/MSA+ (Modified Semi-Additive Process, modified semi-additive method, the core is The thickening of the line is formed on the thin copper, and the SAP (Semi-Additive Process, the core is thickened by plating the ultra-thin copper on the insulating substrate to form the line), from QuickPCB PCB manufacturer factory in China.

(7) According to the core board (Core): Cored (core board PCB), Coreless (coreless board PCB). Coreless can be further divided into ordinary Coreless PCB, ETS (Embedded Trace Substrate PCB, or EPP PCB, Embedded Pattern Process PCB, buried circuit board PCB or flat board PCB), from QuickPCB, PCB manufacturer factory in China.

(8) According to the surface treatment method: tin plating PCB, gold plating PCB(with nickel gold PCB, nickel palladium gold PCB, also have hard gold PCB and soft gold PCB), silver plating PCB, OSP PCB, SOP PCB(Solder On Pad, also known as Bump) and so on. SOP is actually a proprietary, main surface treatment method for FCCSP products mentioned above (the other is OSP PCB, which is low in cost but less used by PCB manufacturer in China). General FCCSP package, It is a more complex PoP package (Packaging on Packaging, usually two types of different chips are packaged in one module).

However, in practice, what is often seen is the hybrid classification method of PCB Printed Circuit Board: single side PCB, double sides PCB, multilayer PCB Printed Circuit Board, HDI PCB Printed Circuit Board, package carrier board PCB, flexible PCB board, rigid-flex PCB Printed Circuit Board, special PCB Printed Circuit Board, which is mainly based on the whole The output value of each segment of the PCB factory industry is divided by PCB manufacturer in China.


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