QuickPCB Quickturn PCB, PCBAssembly manufacturer from China

 

Chinese PCB Manufacturer--Review of the development of PCB manufacturer in China

According to the development of existing literature and PCB(Printed Circuit Board) technology of Printed Circuit Board PCB manufacturer factory in China, the author divides the development process of Printed Circuit Board PCB technology into the following three stages (different from the traditional division stage):

The first stage, from the beginning of the 20th century to 1950, the embryonic period, that is, the early stage of Printed Circuit Board PCB industrialization, at this time the Printed Circuit Board PCB industry has not yet formed in Printed Circuit Board PCB manfacturer in China;

The second stage, from 1950 to 1990, the growth period of Printed Circuit Board PCB manufacturer in China, that is, the early stage of the Printed Circuit Board PCB industrialization period, at which time PCB formed the industry in PCB manufacturer in China and other countries;

The third stage, from 1990 to the present, the development period of Printed Circuit Board PCB manufacturer in China, which is the middle period of the Printed Circuit Board PCB industrialization period

Embryonic period

The iconic PCB Printed Circuit Board technologies at this stage are:

(1) In 1925, Charles Ducas of the United States proposed forming a trench on a dielectric filled with a conductive paste and then electroplating to form a conductor.

(2) In 1936, Paul Ai Sile (Paul Eisler, an Austrian who was unemployed in the UK, graduated from the Vienna University of Technology in 1930, not a doctoral degree in the industry) experimented with the use of foil technology in the radio (A foil membrane technology) In 1943, he applied for a patent covering the ink etching method during the Technograph project invested by the British company Henderson & Spalding (this patent was officially published on June 21, 1950, but was divided into three separate patents: GB639111 (core), GB639178, and GB639179).

(3) In 1936, Japan's Miyamoto Kinosuke (Miyata Hiroyuki, Miyata Manufacturing Co., Ltd.) applied for a patent for the wiring method (Patent No.: 119384, metallization wiring method, see: http ://sts.kahaku.go.jp/sts/detail.php?no=104510511002&).

(4) In 1938, glass fiber began to be produced, whis is Printed Circuit Board PCB laminate material used by Printed Circuit Board PCB manufacturers.

(5) In 1941, the United States introduced a class of Printed Circuit Board PCB technology in the military (painting copper paste on talc as a wire for mortars).

(6) In 1947, an epoxy resin was introduced as a substrate, which is main material of Printed Circuit Board PCB used by Printed Circuit Board PCB manufacturers.

(7) In 1947, Singal Corps of the United States solved the problem of bonding large-area copper foil to insulating materials, that is Printed Circuit Board PCB.

(8) In 1947, the United States NBS (National Bureau of Standards) researched the formation of coils, capacitors, resistors (printed components) and other technologies.

(9) In 1950, Japan applied silver as a conductor on a glass substrate; copper foil was used as a conductor on a phenolic resin paper-based material of Printed Circuit Board PCB.

(10) After 1950, the manufacturing technology of Printed Circuit Board PCB began to be accepted and widely used. At this time, etched foil was the mainstream technology applied by Printed Circuit Board PCB manufacturers.

Looking at it now, the methods of Charles Ducas and Miyamoto Kinosuke among the three people represented at the time belonged to the semi-additive method, and the method of Paul Ai Sile belonged to the subtractive method. Since the subtraction method was first industrialized in the Printed Circuit Board PCB industry and the most widely used by Printed Circuit Board PCB manufacturers, Paul Ai Sile is considered to be the father of Printed Circuit Board PCB. Objectively speaking, the Printed Circuit Board PCB fabrication industry has taken a huge contribution from the embryonic form, birth, development, and innovation, and the US, European, and Japanese practitioners (especially some electronic giants) have contributed greatly.


Growth period

The iconic Printed Circuit Board PCB technologies at this stage are:

(1) In 1953, DuPont of the United States applied for a patent for polyimide products (Patent No.: US2710853A), which required protection of polypyrylene imide resin and its films and tubes (Phompson's polyacyl in the 1960s) Imine film (Kapton®), Vespel® and Pyre ML® are commercially available);

(2) In 1953, Motorola developed a double-panel plated through-hole; before and after 1955, Toshiba Corporation of Japan proposed a process for forming copper oxide on the surface of copper foil, and a copper-clad laminate was introduced. These two methods have also been applied to multilayer boards Printed Circuit Board PCB in the future, and they have also contributed to the advent of multi-layer PCB Printed Circuit Board. Multilayer PCB Printed Circuit Board have led to a significant increase in wiring rates; since then, Printed Circuit Boards PCBs have been widely used.

(3) In 1954, the United States General Electric proposed the use of lead-tin alloy as a corrosion-resistant metal conductor protective layer manufacturing technology by Printed Circuit Board PCB manufacturer.

(4) In 1960, V. Dahlgreen invented the process of bonding metal foil to a thermoplastic film to form a circuit pattern, which is the beginning of Flexible Printed Circuit Board FPC products by FPC manufacturer in China.

(5) In 1960, Japan began to make multilayer Printed Circuit Board PCB from epoxy resin glass cloth substrates by PCB manufacturer factory.

      (6) In 1963, Hazeltine Research Inc. of the United States applied for a patent for electroplated through-hole fabrication of multi-layer Printed Circuit Board PCB factory.

(7) In 1964, Western Electric Company of the United States developed a metal core board with high heat dissipation, this is Metal Core PCB(MCPCB), Aluminum Core PCB from PCB manufacturer factory.

(8) In 1965, Japan developed FR4 and FR5 copper clad laminates (CCL) of epoxy resin glass cloth substrates, which in common PCB material produce by PCB manufacturers.

(9) In 1967, RJ's Robert J. Ryan and others applied for a patent for the manufacture of laminated multi-layer PCB Printed Circuit Board (US3756891, whose core is Plated-up technology), and the industry first proposed layering technology, which applied by multilayer Printed Circuit Board PCB manufacturers.

(10) In 1968, DuPont of the United States invented the photopolymer dry film (Riston®), used by PCB manufacturer to make PCB copper layer circuits.

(11) In 1969, Sanyo Corporation of Japan developed a metal-insulated copper clad laminate, which is used to produce Metal Core PCB(MCPCB) by Metal Core PCB(MCPCB) manufacturers.

(12) In 1969, Philips, the Netherlands, developed FPC (FD-R) made of polyimide, applied by FPC manufacturers in future.

(13) In 1977, Japan's Mitsubishi Gas Chemical Company developed BT resin, used to produce PCB by PCB manufacturer.

(14) In 1979, Pactel invented the "Pactel law" layering method (the inter-layer connection uses a metal column structure), applied by PCB manufacturers.

(15) In 1982, Glen E. Leinbach et al. of HP Corporation of the United States developed a Multilayer substrate with a micro-blind hole (called "Finstrate", which uses a laser to process a blind hole with a hole diameter of 0.125 mm by PCB manufacturer). This method is used to produce HDI PCB by HDI PCB manufacturers.

(16) In 1984, NTT invented a ceramic substrate with a "Copper Polyimide Act" with a thin film circuit. The insulating layer is a photosensitive resin, and the via holes are formed by exposure and development of the photosensitive resin.This is PCB manufacturing method is used to produce Printed Circuit Board PCB by PCB manufacturers

(17) In 1988, Siemens developed a 10-layer and above "Microwiring Substrate" laminated PCB Printed Circuit Board for large computers, using a excimer laser to process blind holes by PCB manufacturer.


Development period

Iconic technology

The iconic Printed Circuit Board PCB technologies at this stage are:

(1) In 1990, Japan's IBM (Yasu) developed a SLC (Surface Laminar Circuit) carrier for Flip Chip connection of semiconductors, applied to PCB factory.

(2) In 1993, Motorola's Paul T. Lin and others applied for a BGA package patent (US5216278 A), which opened the era of organic carrier packaging for PCB manufacturers.

(3) In 1995, Matsushita Electronics Co., Ltd. developed a laminated Printed Circuit Boardv PCB process of ALIVH (Any Layer Interstitial Via Hole structure), applied to HDI PCB manufacturers factory soon.

(4) In 1996, Toshiba developed the process of B2it (Buried Bump Interconnection Technology) used by PCB manufacturers factory.

(5) Japan's North developed the NMBI (Neo-Manhattan Bump Interconnection, new type of column bump interconnect technology) process, and later the US Tessera improved the process used to PCB manufacturer factory

(6) Ibiden developed the FVSS (Free Via Stackedup Structure) process, originally called SSP technology (Single Step Process), now called FVSS by PCB manfacturers factory.


Looking at these layering techniques, the core is how to achieve interlayer interconnection of Printed Circuit Board PCB. There are two ways to achieve interlayer interconnection by PCB Printed Circuit Board manufacturers in China. One is to achieve conduction through direct hole formation, electroplating or filling of conductive materials (such as SLC, HITAVIA, ALIVH, FVSS, VIL) by PCB manufacturers; the second is PCB manufacturers to use bumps (indirectly into holes) to directly achieve mutual Connected (such as B2it, NMBI). It is worth mentioning that most of the proponents of these new technologies are Japanese companies PCB manufacturers. It can be said that Japanese PCB manufacturer companies have contributed a lot to the PCB manufacturers factory industry in the development of laminated PCB technology (especially new PCB process tests, new PCB material development, new PCB equipment development). ).


For the direct hole forming process applied by PCB manufacturers, there were five main types of hole forming techniques: photoinduced, laser (UV and CO2), plasma, excimer, and mechanical drill. Due to the limitations of other hole forming technologies or due to the growing and mature laser technology, the most widely used in the PCB manufacturer factory is the laser hole forming process. For the indirect hole forming technology, due to the limitations of its technology or the development and maturity of the laser hole forming + plating hole filling process, the application is gradually decreasing by PCB manufacturer factory. Therefore, the current lamination process is mainly laser drilling + electroplating and hole filling process in PCB manufacturer's factory.


At the time, based on this layered technology, according to the actual needs of the end customers, PCB manufacturer factory formed two directions: HDI (Subtractive reduction method based, based on FR-4 material, assembly technology) and Substrate (MSAP/SAP half). The additive process is based on BT, ABF materials, and packaging technology. The process flow of the line formation method is shown PCB manufacturer factory. However, since 2014, HDI and Substrate have begun to merge with products such as Apple's mobile phones and watches, produced by PCB manufacturers in China.


HDI

For HDI products, in the past 20 years, based on laser hole forming + electroplating copper process, HDI process has undergone the following changes by PCB manufacturer in China: ConformalMask→LargeWindow→SmallWindow→LDD (LaserDirect Drilling, CO2 laser direct drilling, said PCB manufacturer in China. Note: Substrate uses UV laser drilling and CO2 laser drilling); copper plating → copper filling; film contact exposure → LDI (Laser Direct Imaging); first order → second order → multi-order → AnyLayer (soft and hard combination The board's hard board area is also used by AnyLayer technology), explained PCB manufacturer in China.

At present, HDI's representative product (Any Layer structure) is applied to the mobile phone motherboard by PCB manufacturer factory. Take Samsung's Note 8 motherboard as an example. It is designed as a 12-layer Any Layer Printed Circuit Board PCB with a BGA pitch of 350mm and a board thickness of 650mm.

Recently, regarding HDI, the new technology developed by the Printed Circuit Board PCB manufacturer factory has ultra-thin plates, Cavity (cavity plate, or step plate, divided into Non Component Type non-pad type and Component Type pad type), just - The rigid plate area of the flexible bonding plate is an Any Layer or the like, explained PCB manufacturer in China.

Printed Circuit Board PCB Substrate

At present, Printed Circuit Board PCB Substrate's representative products are in mobile phones, computer main processors and other applications, said PCB manufacturers in China.

Recently, regarding Printed Circuit Board PCB Substrate, Printed Circuit Board PCB manufacturer in China has developed many new processes. Due to the special nature of Printed Circuit Board PCB Substrate products, many processes are developed in conjunction with the back-end packaging, even directly by the packaging company or chip design company.

Some representative Printed Circuit Board PCB technologies are:

(1) BBUL: Intel's Steven N. Towle et al. proposed BBUL (Bumpless Build-UpLayer packaging) in October 2001. The core of the chip is the interconnection of the chip and the carrier. It is a bump, but the chip is buried directly inside the carrier Printed Circuit Board PCB, said Printed Circuit Board PCB manufacturers in CHina. (Although the BBUL process is still not mass-produced due to technical problems, the embedded component technology inside the Printed Circuit Board PCB is the unremitting pursuit of the PCB manufacturer factory. And development direction).

(2) EPS/EAD: EPS (Embedded Passive Substrate), mass production in 2011; EAD (Embedded Active Device, embedded active components), mass production is rare. The internal buried passive components are shown by PCB manufacturer in China (this capacitor is slightly different from conventional capacitors).

(3) ECP®: AT&S has developed ECP® (Embedded Component Packaging) technology to embed active and passive components on Printed Circuit Board PCB.

(4) SESUB: TDK developed SESUB (Semiconductor Embedded in SUBstrate) technology used by Printed Circuit Board PCB manufacturer factory

(5) MCeP®: Shinko Electric has developed MCeP® (Molded Core embeddedPackage) technology to embed active and passive components in Printed Circuit Board PCB manufacturer factory.

(6) Coreless: including common Coreless and ETS (Embedded Trace Substrate), ETS is mostly used in low-end Flip Chip package (can improve yield and reduce cost), and rises in 2013 by PCB Printed Circuit Board manufacturers factory.

(7) Padless: Padless is mainly used to improve wiring density and design flexibility by PCB Printed Circuit Board manufacturer factory.

(8) BSP (Blue Stencil Printing): In order to improve the production yield of Printed Circuit Board PCB manufacturer factory and efficiency of Fine pitch bump (SOP), Samsung Motor developed BSP in 2010 to replace the traditional Metal Mask by PCB manufacturer factory.

(9) Via Post: ACCESS developed a copper column (via) technology for plating from the bottom of the hole, without laser drilling + plating filling by Printed Circuit Board PCB manufacturer in China

(10) MIS: Molded Interconnect Substrate (Molded Interconnect System, or Molded Interconnect System), originally developed by APSi (Advanpack Solutions Innovations), which uses epoxy resin as a substrate to form copper by PCB factory manufacturer in China. Column technology. Currently, Substrate and the company are developing MIS technology. QDOS MIS, see Figure 37. Hengjin (PPt) named its MIS-like product C2iM® (Copper Connection in Molding).

In summary, various processes are used to produce a comparison of the manufacturing process capabilities and costs of the PCB by Printed Circuit Board PCB manufacturer factory in China.

In addition, various embedded component technologies for PSMA finishing


QuickPCB, high quality quick turn PCB sample and volume PCB production manufacturer in Shenzhen, China

Quick turn PCB sample manufacturer factory in China

Quickturn metal core PCB manufacturer factory in China

Quick turn Multilayer PCB manufacturer factory in China

Quick turn FPC manufacturer factory in China

Quick turn Rigid-flex PCB manufacturer factory in China

Quick turn PCB assembly manufacturer factory in China




Tell us what we can do for you!
pcb@quickpcbs.com
QuickPCB
Quickturn PCB Manufacturer
Quickturn PCB Assembly Manufacturer
QuickPCB is from Shenzhen, China
Service customers from different countries or areas.

Quickturn PCB samples manufacturer in China
Multilayer PCB manufacturer in China
Metal Core PCB(MCPCB) manufacturer in China
Aluminum Core PCB manufacturer in China
Flexible PCB FPC manufacturer in China
Rigid-flex PCB manufacturer in China
PCB assembly(PCBA) manufacturer in China