QuickPCB, HDI PCB manufacturer in China. High TG HDI laser blind via 0.1mm and laser buried via 0.1mm, High Density Interconnect PCB manufacturer。
One-step HDI PCB is formed by pressing it once. It can be imagined as the most common board.
Two-step HDI PCB is pressed twice. Take the eight-layer board with blind and buried holes as an example. First make a 2-7-layer board and press it. At that time, the 2-7 through holes and buried holes have been completed, and then add 1 layer and 8 layers, and punch 1-8 through holes to make the whole board.
Three-step HDI PCB is more complicated than the above, first press 3- 6 layers, plus 2 and 7 layers, and finally 1 to 8 layers.
High Density Interconnection (HDI) rigid-flex PCB Printed Circuit Boards are high-end PCB Printed Circuit Board products, and their purpose is to meet the development needs of electronic products in the direction of miniaturization, high frequency and high speed, and multi-function. HDI rigid-flex PCB combines the advantages of ordinary HDI PCB and Rigid-flex PCB, and promotes the development of high integration and high intelligence in electronic system design and manufacturing. It has been widely used in high-end aerospace technology, medical equipment, and consumer products. In electronic products. Blind via manufacturing technology is one of the most critical technologies in the HDI rigid-flex PCB manufacturing process, and it is the main way to achieve inter-layer interconnection. This subject combines the actual production to study the blind hole manufacturing technology of HDI Rigid-flex PCB. Compared with traditional mechanical hole processing technology, laser technology to make micro blind holes shows the advantages of high efficiency and high precision. This paper discusses the influencing factors of ultraviolet (Ultraviolet, UV) laser processing blind holes, and optimizes the UV laser processing parameters that affect the drilling depth through orthogonal optimization experiments. The results show that the primary and secondary relationship of the laser parameters on the drilling depth is: laser Power processing speed, laser frequency, Z axis height, and the best process parameters and methods for UV laser production of 200μm first-order and second-order blind holes. The plasma has both the functions of making and cleaning blind holes. The process parameters affecting the etch depth of polyimide (PI) were optimized through orthogonal optimization experiments. The results show that: the processing time has the greatest influence on the PI etch depth, and the etch depth increases with time; the process parameters for the plasma etched blind hole with a diameter of 100 μm on a PI double-sided board with a thickness of 25 μm are: RF The power is 2500W, the volume ratio of O_2 and CF4 gas is 12:5, the total gas volume is 1000ml/min, and the time is 25min. At the same time, this article studies the effect of plasma on blind holes cleaning, and the results show that the plasma etching rate on the substrate is: acrylic resin polyimide epoxy resin. The purpose of black hole technology is to form a thin conductive layer on the hole wall through physical adsorption. Epoxy resin and polyimide (PI) were selected as substrates, and the effects of black hole liquid treatment time, temperature, black hole liquid concentration, black hole treatment method, etc. on the effect of black hole black holes were discussed. The adsorption rate of carbon black on the substrate. The results show that the adsorption rate of black-pored carbon black on epoxy resin substrate is faster than that on polyimide substrate. The use of two black-hole technology can effectively prevent the PI plating holes in the inner layer of HDI Rigid-flex PCB. HDI PCB manufacturer invented a new process method for making second-order blind vias by laminating. The pore size deformability of epoxy resin film before and after lamination was studied, and the trend of pore size deformation of epoxy resin film was summarized. Through the analysis and optimization of the production process, a new method of second-order blind holes composed of PI double-sided boards, epoxy resin film and copper foil with a diameter of 100μm has been developed. This method can greatly reduce the traditional production of blind holes. The method has the characteristics of fast, simple, economical and applicable to the limitation of materials. Combined with the above research results, the entire production process was optimized, and the eight-layer HDI Rigid-flex PCB process test board with second-order blind holes was realized, which laid the foundation for the industrialization of this type of product.
