Holes Used in PCB: Laser Via

Laser via, also known as small hole, micro hole, or laser hole, is a type of hole that is drilled using a laser beam. Because the energy of the laser is fixed, if the copper foil is too thick, the laser cannot penetrate it once and needs to be struck multiple times; If the copper foil is too thin, the laser will penetrate it again. Therefore, the thickness of the copper foil used for the laser hole is 1/3Oz per board, which just meets the requirement of laser penetration. At present, the minimum laser hole diameter used in PCB design is 0.075mm. Using laser holes will greatly increase the production cost of the circuit board, and the stability is worse than mechanical holes. This is also the reason why many industries rarely use laser holes.