QuickPCB Process Capability | |||
Item | Standard | Advanced | |
Layer count | 36L | 48L | |
Board thickness | 5.5mm | 6.5mm | |
Aspect ratio | 10:01 | 14:01 | |
Copper thickness | 10 OZ | 16 OZ | |
Maxium PCB size | 1L: | 580×1500mm | 580×1500mm |
2L : | 580×1500mm | 580×1500mm | |
≥4L: | 580*812mm | 580*812mm | |
Min. doube side board thickness | 0.2mm | 0.1mm | |
Min. 4L board thickness | 0.38mm | 0.35mm | |
Min. hole & pad size | 0.20/0.40mm | 0.15/0.35mm | |
Drilling Acuracy | ±0.05mm | ±0.038mm | |
Min. solder mask bridge | 0.065mm | 0.065mm | |
PTH hole size tolerance | ±0.05mm | ±0.038mm | |
Contour tolerance | ±0.05mm | ±0.05mm | |
Impedance tolerance | ±8% | ±6%(Differential impedance) | |
Min. line width/spacing | 0.075/0.075mm | 0.065/0.065mm | |
Surface finish | ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink | ||
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